The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Dec. 21, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Veronica Strong, Hillsboro, OR (US);

Telesphor Kamgaing, Chandler, AZ (US);

Aleksandar Aleksov, Chandler, AZ (US);

Georgios C. Dogiamis, Chandler, AZ (US);

Brandon Rawlings, Chandler, AZ (US);

Neelam Prabhu Gaunkar, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01);
Abstract

Embodiments disclosed herein include an electronic package that comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, the substrate comprises glass. In an embodiment, the electronic package further comprises an opening through the substrate from the first surface to the second surface, where the opening comprises a first end proximate to the first surface of the substrate, a second end proximate to the second surface of the substrate, and a middle region between the first end and the second end. In an embodiment, the middle region has a discontinuous slope at junctions with the first end and the second end.


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