The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Jun. 16, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Aleksandar Aleksov, Chandler, AZ (US);
Telesphor Kamgaing, Chandler, AZ (US);
Neelam Prabhu Gaunkar, Chandler, AZ (US);
Georgios C. Dogiamis, Chandler, AZ (US);
Veronica Strong, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 40/47 (2026.01); H10W 40/00 (2026.01); H10W 40/43 (2026.01); H10W 70/05 (2026.01); H10W 70/63 (2026.01); H10W 70/65 (2026.01); H10W 70/68 (2026.01); H10W 70/692 (2026.01);
U.S. Cl.
CPC ...
H10W 40/47 (2026.01); H10W 40/037 (2026.01); H10W 40/43 (2026.01); H10W 70/095 (2026.01); H10W 70/635 (2026.01); H10W 70/65 (2026.01); H10W 70/68 (2026.01); H10W 70/692 (2026.01);
Abstract
Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surface opposite from the first surface. In an embodiment, a buildup layer is over the first surface of the core. In an embodiment, a channel is through the core, where the channel extends in a direction that is substantially parallel to the first surface.