The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Dec. 23, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Neelam Prabhu Gaunkar, Chandler, AZ (US);

Georgios C. Dogiamis, Chandler, AZ (US);

Telesphor Kamgaing, Chandler, AZ (US);

Aleksandar Aleksov, Chandler, AZ (US);

Brandon Rawlings, Chandler, AZ (US);

Veronica Strong, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/498 (2006.01); H01Q 9/04 (2006.01); H05K 1/181 (2026.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/49827 (2013.01); H01Q 9/0407 (2013.01); H05K 1/181 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/1053 (2013.01);
Abstract

Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a buildup layer is over the core. In an embodiment, a patch antenna with a first patch is under the core, and a second patch is over a surface of the core opposite from the first patch. In an embodiment, the electronic package further comprises a via through the core and coupled to the patch antenna.


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