The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Jun. 17, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Aleksandar Aleksov, Chandler, AZ (US);
Neelam Prabhu Gaunkar, Chandler, AZ (US);
Georgios C. Dogiamis, Chandler, AZ (US);
Telesphor Kamgaing, Chandler, AZ (US);
Veronica Strong, Hillsboro, OR (US);
Johanna M. Swan, Scottsdale, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01F 27/28 (2006.01); H01L 21/48 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01F 27/2804 (2013.01); H01L 21/486 (2013.01); H01L 23/58 (2013.01);
Abstract
Embodiments disclosed herein include electronic packages with magnetic features and methods of forming such packages. In an embodiment, a package substrate comprises a core and a conductive via through a thickness of the core. In an embodiment, a shell surrounds a perimeter of the conductive via and the shell is a magnetic material. In an embodiment, a surface of the conductive via is spaced away from the shell.