Hwaseong, South Korea

Unbyoung Kang

This inventor holds 22 USPTO granted patents and 46 published patent applications, primarily in Semiconductor Packaging. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2022-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Unbyoung Kang. Retrieved from https://idiyas.com/inventor/unbyoung-kang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 100.0

Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 7(Granted Patents)


Location History:

  • Hwaseong-si, KR (2022 - 2024)
  • Suwon-si, KR (2023 - 2024)

Company Filing History:


Years Active: 2022-2025

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Areas of Expertise:
Semiconductor Package
Manufacturing Method
Chip Design
Molding Apparatus
Thermal Interface Material
Die-to-Wafer Bonding
Wafer Trimming
Underfill Structures
Insulating Material Layer
Semiconductor Device
Through Electrode
22 patents (USPTO):Explore Patents

Title: Unbyoung Kang: A Pioneer in Semiconductor Innovation

Introduction

Unbyoung Kang is a distinguished inventor based in Hwaseong-si, South Korea, known for his significant contributions to the field of semiconductor technology. With a remarkable portfolio of 17 patents, Kang has been instrumental in advancing the methods and structures involved in semiconductor packaging.

Latest Patents

Among his latest patents, Kang has developed innovative solutions such as a semiconductor package and a method of forming the same. This patent outlines a semiconductor package comprising a semiconductor substrate with both a chip area and a dummy area. It features a front structure with an internal circuit and connection pattern, alongside a rear protective layer that overlaps the chip and dummy areas. The through-electrode structure enhances electrical connectivity, ensuring optimal performance of the semiconductor package. Furthermore, his method of manufacturing a semiconductor package discusses a unique bonding process that incorporates planarization techniques for better structural integrity.

Career Highlights

Kang's career is marked by his tenure at Samsung Electronics Co., Ltd., where he has played a vital role in enhancing semiconductor technologies. His work not only improves existing technologies but also paves the way for future innovations in the field.

Collaborations

Collaboration has been a key aspect of Kang's success. He has worked alongside colleagues such as Teakhoon Lee and Jihwan Hwang, combining their expertise to further advance semiconductor packaging techniques. This teamwork highlights the importance of collaboration in the realm of technology and innovation.

Conclusion

Unbyoung Kang stands out as a leading inventor in the semiconductor sector, with a strong patent portfolio reflecting his innovative spirit. His contributions at Samsung Electronics Co., Ltd. and his collaborative efforts with peers reinforce the significance of teamwork in technological advancements. As the field of semiconductor packaging continues to evolve, Kang's inventions will undoubtedly play a crucial role in its future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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