The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
May. 27, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Dongjoon Oh, Suwon-si, KR;
Unbyoung Kang, Hwaseong-si, KR;
Byeongchan Kim, Asan-si, KR;
Jumyong Park, Cheonan-si, KR;
Solji Song, Suwon-si, KR;
Chungsun Lee, Asan-si, KR;
Hyunsu Hwang, Siheung-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes: a first semiconductor chip including a first semiconductor substrate including a first active surface and a first inactive surface opposite to each other and a plurality of first chip pads on the first active surface; a second semiconductor chip including a second semiconductor substrate including a second active surface and a second inactive surface opposite to each other and a plurality of second chip pads on the second active surface, the second active surface being stacked on the first semiconductor chip to face the first inactive surface; a bonding insulation material layer interposed between the first semiconductor chip and the second semiconductor chip; and a plurality of bonding pads surrounded by the bonding insulation material layer to electrically connect the first semiconductor chip to the second semiconductor chip.