Anyang, South Korea

Chungsun Lee

This inventor holds 40 USPTO granted patents and 21 published patent applications, primarily in Semiconductor Packaging. Top assignees: Samsung Electronics Co., Ltd., Samsung Electronics Ltd.. Active years: 2012-2026.

USPTO Granted Patents = 40 

% Patents Active = 97.5

Average Co-Inventor Count = 4.9

ph-index = 5

Forward Citations = 127(Granted Patents)


Location History:

  • Anyang, KR (2012)
  • Gunpo-si, KR (2014 - 2015)
  • Anyang-si, KR (2015 - 2024)
  • Asan-si, KR (2022 - 2024)

Company Filing History:


Years Active: 2012-2026

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Areas of Expertise:
Semiconductor Package
Interconnection Structure
Wafer Etching
Fabrication Method
Image Sensor Chip
Redistribution Patterns
Through Silicon Vias
Dry Etching Apparatus
Molding Apparatus
Bump Structure
Wafer Trimming Device
Device Processing
40 patents (USPTO):Explore Patents

Title: Chungsun Lee: Innovator in Semiconductor Packaging

Introduction

Chungsun Lee, based in Anyang-si, South Korea, is an accomplished inventor with a significant portfolio of 20 patents. His contributions to the field of semiconductor packaging have made a notable impact in the technology sector, particularly at Samsung Electronics Co., Ltd.

Latest Patents

Among his latest innovations are advanced semiconductor packages. One notable patent describes a semiconductor package that integrates a first semiconductor chip with a first semiconductor substrate and a number of first through electrodes. This design facilitates efficient stacking of multiple second semiconductor chips on the first, optimizing space and performance. Another of his patents introduces a semiconductor package featuring both first and second redistribution patterns at different levels. This intricate design comprises a redistribution substrate with uniquely structured metal patterns and barrier patterns that enhance electrical connectivity, thereby improving functionality and reliability.

Career Highlights

Chungsun Lee has established himself as a valuable asset in the semiconductor industry through his work at Samsung Electronics Co., Ltd. His innovative approaches to semiconductor packaging have not only resulted in numerous patents but have also contributed to the advancement of technology within the company and beyond.

Collaborations

Throughout his career, Chungsun has collaborated with other prominent figures in the field, including Kwang-Chul Choi and Jung-Hwan Kim. These collaborations have further enriched his work, allowing for shared insights and advancements in semiconductor technology.

Conclusion

Chungsun Lee's dedication to innovation and his significant contributions to semiconductor packaging underline his role as a key inventor at Samsung Electronics Co., Ltd. With a growing number of patents, he continues to shape the future of the semiconductor industry, showcasing the importance of innovative thinking in technology development.

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