The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12444703 B1

Date of Patent:

Oct. 14, 2025

Filed:

Sep. 13, 2022

Manufacturing method of semiconductor chip

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yongbum Kwon, Yongin-si, KR;

Unbyoung Kang, Hwaseong-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Attorney:

Wolf, Greenfield & Sacks, P.C.

Primary Examiner:

Dale E Page

Assistant Examiner:

Wilner Jean Baptiste

Int. Cl.

CPC ...

H01L 25/065 (2023.01); H01L 23/00 (2006.01);

U.S. Cl.

CPC ...

H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/0657 (2013.01); H01L 24/16 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/03602 (2013.01); H01L 2224/03616 (2013.01); H01L 2224/03901 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/05011 (2013.01); H01L 2224/05078 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05181 (2013.01); H01L 2224/05187 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05551 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05578 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05681 (2013.01); H01L 2224/05687 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/8083 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01);

Abstract

A method of manufacturing a semiconductor chip is provided. The method includes: forming a plurality of bonding pads on a semiconductor wafer, sequentially forming an insulating layer and a polishing stop film on the semiconductor wafer to cover the plurality of bonding pads, the insulating layer and the polishing stop film having a plurality of convex portions corresponding to upper portions of the plurality of bonding pads, polishing the plurality of convex portions using the polishing stop film to expose upper surfaces of the plurality of bonding pads, and removing the polishing stop film.

Find Patent Forward Citations