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For the Inventor, By the Inventor

Tokyo, Japan

Toshiyuki Yoshikawa

This inventor holds 25 USPTO granted patents and 1 published patent application, primarily in Wafer Processing. Top assignees: Disco Corporation, Kuraray Co., Ltd., Tokyo Ohka Kogyo Co., Ltd.. Active years: 1998-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshiyuki Yoshikawa. Retrieved from https://idiyas.com/inventor/toshiyuki-yoshikawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 96.0

Average Co-Inventor Count = 2.8

ph-index = 8

Forward Citations = 644(Granted Patents)


Location History:

  • Tsukuba, JP (2008)
  • Ota-Ku, JP (2015)
  • Tokyo, JP (1998 - 2023)

Company Filing History:

goldMedal20 out of 1,661 
 
Disco Corporation
 patents
silverMedal5 out of 1,872 
 
Kuraray Co., Ltd.
 patents
bronzeMedal1 out of 1,236 
 
Tokyo Ohka Kogyo Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 1998-2026

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Areas of Expertise:
Wafer Processing
Laser Processing
Semiconductor Chip
Protective Film
Wafer Treatment
Dicing Method
Lightguide
Panel Light Source
Liquid Crystal Display
Workpiece Dividing
Condensing Spot Detection
25 patents (USPTO):Explore Patents
1. 12532684 - Protective film substance for laser processing and method of processing workpiece (2026-01-20),
2. 12322638 - Processing apparatus (2025-06-03),
3. 12191138 - Processing method of workpiece (2025-01-07),
4. 11764085 - Processing apparatus (2023-09-19),
5. 11251083 - Workpiece processing method and device chip manufacturing method (2022-02-15),
6. 10086474 - Protective film applying apparatus and protective film applying method (2018-10-02),
7. 9748119 - Wafer processing method (2017-08-29),
8. 9685378 - Method of dividing plate-shaped workpieces (2017-06-20),
9. 9620355 - Wafer processing method (2017-04-11),
10. 9090783 - Protective film agent for laser dicing and wafer processing method using the protective film agent (2015-07-28),
11. 8957347 - Method of detecting condensing spot position in laser beam processing apparatus (2015-02-17),
12. 7737002 - Wafer dividing method (2010-06-15),
13. 7648850 - Method for producing semiconductor chip (2010-01-19),
14. 7468309 - Semiconductor wafer treatment method (2008-12-23),
15. 7446022 - Wafer laser processing method (2008-11-04),

Title: The Inventive Journey of Toshiyuki Yoshikawa: Innovations in Workpiece Processing.

Introduction: Toshiyuki Yoshikawa, a talented inventor hailing from Tokyo, Japan, has made significant strides in the field of workpiece processing with a remarkable portfolio of 22 patents to his name.

Latest Patents: Among his latest innovations is a cutting-edge processing apparatus that revolutionizes workpiece handling. This apparatus includes a range of mechanisms for efficient tape attachment, pressure bonding, and reinforcement section removal for enhanced workpiece processing.

Career Highlights: Toshiyuki Yoshikawa has honed his craft while working at esteemed companies such as Disco Corporation and Kuraray Co., Ltd., where his inventive spirit and dedication to innovation have flourished. His commitment to advancing workpiece processing methods is evident in his patent portfolio.

Collaborations: Throughout his career, Toshiyuki Yoshikawa has collaborated with industry peers such as Senichi Ryo and Nobuyasu Kitahara, pooling their expertise to push the boundaries of chip manufacturing methods and device processing techniques.

Conclusion: Toshiyuki Yoshikawa's inventive prowess and contributions to the realm of workpiece processing underscore his status as a trailblazer in the industry. His innovative approach and relentless pursuit of excellence continue to inspire future generations of inventors in Tokyo, JP, and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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