Toshiyuki Yoshikawa

USPTO Granted Patents = 24 (Patent Applications = 2)

Average Co-Inventor Count = 2.8

ph-index = 8

Forward Citations = 639(Granted Patents)

Location History:

Tsukuba, JP (2008)
Ota-Ku, JP (2015)
Tokyo, JP (1998 - 2023)

Company Filing History:

Tokyo Ohka Kogyo Co., Ltd.

patents

where one patent can have more than one assignee

Years Active: 1998-2025

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24 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12322638 - Processing apparatus (2025-06-03),

2. 12191138 - Processing method of workpiece (2025-01-07),

3. 11764085 - Processing apparatus (2023-09-19),

4. 11251083 - Workpiece processing method and device chip manufacturing method (2022-02-15),

5. 10086474 - Protective film applying apparatus and protective film applying method (2018-10-02),

6. 9748119 - Wafer processing method (2017-08-29),

7. 9685378 - Method of dividing plate-shaped workpieces (2017-06-20),

8. 9620355 - Wafer processing method (2017-04-11),

9. 9090783 - Protective film agent for laser dicing and wafer processing method using the protective film agent (2015-07-28),

10. 8957347 - Method of detecting condensing spot position in laser beam processing apparatus (2015-02-17),

11. 7737002 - Wafer dividing method (2010-06-15),

12. 7648850 - Method for producing semiconductor chip (2010-01-19),

13. 7468309 - Semiconductor wafer treatment method (2008-12-23),

14. 7446022 - Wafer laser processing method (2008-11-04),

15. 7440049 - Backlight device for liquid crystal display (2008-10-21),

Title: The Inventive Journey of Toshiyuki Yoshikawa: Innovations in Workpiece Processing.

Introduction: Toshiyuki Yoshikawa, a talented inventor hailing from Tokyo, Japan, has made significant strides in the field of workpiece processing with a remarkable portfolio of 22 patents to his name.

Latest Patents: Among his latest innovations is a cutting-edge processing apparatus that revolutionizes workpiece handling. This apparatus includes a range of mechanisms for efficient tape attachment, pressure bonding, and reinforcement section removal for enhanced workpiece processing.

Career Highlights: Toshiyuki Yoshikawa has honed his craft while working at esteemed companies such as Disco Corporation and Kuraray Co., Ltd., where his inventive spirit and dedication to innovation have flourished. His commitment to advancing workpiece processing methods is evident in his patent portfolio.

Collaborations: Throughout his career, Toshiyuki Yoshikawa has collaborated with industry peers such as Senichi Ryo and Nobuyasu Kitahara, pooling their expertise to push the boundaries of chip manufacturing methods and device processing techniques.

Conclusion: Toshiyuki Yoshikawa's inventive prowess and contributions to the realm of workpiece processing underscore his status as a trailblazer in the industry. His innovative approach and relentless pursuit of excellence continue to inspire future generations of inventors in Tokyo, JP, and beyond.

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2 patents pending:

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