The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Dec. 05, 2019
Applicant:
Disco Corporation, Tokyo, JP;
Inventors:
Kenta Nakano, Tokyo, JP;
Hideyuki Kawaguchi, Tokyo, JP;
Yuki Ikeda, Tokyo, JP;
Toshiyuki Yoshikawa, Tokyo, JP;
Senichi Ryo, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 21/56 (2006.01); H01L 21/306 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/82 (2013.01); H01L 21/30617 (2013.01); H01L 21/56 (2013.01); H01L 21/6836 (2013.01);
Abstract
A method of processing a workpiece includes: a frame unit preparing step of preparing a frame unit including a tape affixed to an undersurface of the workpiece; a protective film forming step of forming a protective film on a top surface of the workpiece; a cutting step of cutting the workpiece by applying a laser beam; an interval expanding step of widening intervals between chips formed in the cutting step by expanding the tape outward in a radial direction; and an etching step of removing altered regions formed in the respective chips.