Senichi Ryo is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing, holding a total of 15 patents. His innovative methods have advanced the technology used in the semiconductor industry.

Latest Patents

One of his latest patents is a method of processing a wafer that includes a plurality of devices. This method involves coating the face side of the wafer with a protective film agent, drying it to form a protective film, and applying a laser beam along projected dicing lines. This process creates laser-processed slots in the wafer, followed by cleaning away the protective film and applying ultraviolet rays to remove any organic substances. The final step involves covering the areas corresponding to the devices with an encapsulating resin. Another notable patent is for a protective film agent used during the processing of a workpiece. This agent consists of a water-soluble resin, a light-absorbing agent with specific structures, and a solvent that dissolves both components.

Career Highlights

Senichi Ryo is currently employed at Disco Corporation, where he continues to develop innovative solutions in wafer processing. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Throughout his career, Senichi has collaborated with notable colleagues, including Yukinobu Ohura and Toshiyuki Yoshikawa. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Senichi Ryo's contributions to wafer processing technology have established him as a key figure in the semiconductor industry. His innovative patents and collaborative efforts continue to shape the future of this critical field.

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