The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Jul. 26, 2016
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Senichi Ryo, Tokyo, JP;

Hirokazu Matsumoto, Tokyo, JP;

Toshiyuki Yoshikawa, Tokyo, JP;

Yukinobu Ohura, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 29/20 (2006.01); B23K 26/364 (2014.01); B23K 26/402 (2014.01); B23K 26/18 (2006.01); H01L 21/683 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B23K 26/18 (2013.01); B23K 26/364 (2015.10); B23K 26/402 (2013.01); H01L 21/6715 (2013.01); H01L 21/67034 (2013.01); H01L 21/67092 (2013.01); H01L 29/20 (2013.01); B23K 2203/50 (2015.10); B23K 2203/56 (2015.10); H01L 21/6838 (2013.01);
Abstract

Disclosed herein is a wafer processing method in which laser processing is carried out on a wafer along streets. The wafer processing method includes a step of holding the wafer by a chuck table, a protective film forming step of forming a water-soluble protective film on a surface of the wafer, a laser beam irradiating step of irradiating the wafer with a laser beam along the streets after the protective film forming step, a step of supplying a chemical having an amino group to the wafer, and a removing step of cleaning and removing a compound that is generated by the supplying of the chemical having an amino group and contains phosphorus.


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