The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

Feb. 15, 2022
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Yoshinori Kakinuma, Tokyo, JP;

Yoshinobu Saito, Tokyo, JP;

Yukiyasu Masuda, Tokyo, JP;

Toshiyuki Yoshikawa, Tokyo, JP;

Toshio Tsuchiya, Tokyo, JP;

Masanobu Takenaka, Tokyo, JP;

Tomoyuki Hongo, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B23K 26/364 (2014.01); B23K 26/402 (2014.01); B23K 103/00 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B23K 26/364 (2015.10); B23K 26/402 (2013.01); H01L 21/67775 (2013.01); B23K 2103/56 (2018.08);
Abstract

A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the annular frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to the back surface of the wafer, a frame unit carrying-out unit, and a reinforcing part removing unit that cuts and removes a ring-shaped reinforcing part from the wafer of a frame unit.


Find Patent Forward Citations

Loading…