The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Feb. 17, 2010
Hiroshi Takanashi, Kanagawa-ken, JP;
Atsushi Kawakami, Kanagawa-ken, JP;
Toshiyuki Yoshikawa, Tokyo, JP;
Nobuyasu Kitahara, Tokyo, JP;
Hiroshi Takanashi, Kanagawa-ken, JP;
Atsushi Kawakami, Kanagawa-ken, JP;
Toshiyuki Yoshikawa, Tokyo, JP;
Nobuyasu Kitahara, Tokyo, JP;
TOKYO OHKA KOGYO CO., LTD., Kawasaki-Shi, Kanagawa-Ken, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions.