The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2023
Filed:
Jul. 09, 2021
Disco Corporation, Tokyo, JP;
Yukiyasu Masuda, Tokyo, JP;
Yoshikuni Migiyama, Tokyo, JP;
Takashi Uchiho, Tokyo, JP;
Ryosuke Kurosawa, Tokyo, JP;
Toshiyuki Yoshikawa, Tokyo, JP;
Toshio Tsuchiya, Tokyo, JP;
Masanobu Takenaka, Tokyo, JP;
Tomoyuki Hongo, Tokyo, JP;
Takashi Mori, Tokyo, JP;
Yoshinori Kakinuma, Tokyo, JP;
Yoshinobu Saito, Tokyo, JP;
Jonghyun Ryu, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.