Osaka, Japan

Takashi Kasuga

This inventor holds 21 USPTO granted patents and 4 published patent applications, primarily in Printed Circuit Boards. Top assignees: Sumitomo Electric Industries, Limited, Sumitomo Electric Printed Circuits, Inc.. Active years: 2007-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takashi Kasuga. Retrieved from https://idiyas.com/inventor/takashi-kasuga

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 

% Patents Active = 85.7

Average Co-Inventor Count = 5.1

ph-index = 3

Forward Citations = 48(Granted Patents)


Company Filing History:


Years Active: 2007-2026

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Areas of Expertise:
Printed Circuit Board
Manufacturing Method
Substrate
Electronic Component
Resin Film
Flexible Wiring Board
Metal Powder
Conductive Silver Paste
Sintered Body
Printed Wiring Board
Seal Structure
21 patents (USPTO):Explore Patents

Title: Takashi Kasuga - Innovative Inventor from Osaka

Introduction: Takashi Kasuga is a renowned inventor hailing from Osaka, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Takashi Kasuga holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Takashi Kasuga has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant technological breakthroughs.

Collaborations: Throughout his career, Takashi Kasuga has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Takashi Kasuga's passion for innovation and his relentless pursuit of technological excellence have solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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