The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Dec. 21, 2015
Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;
Sumitomo Electric Printed Circuits, Inc., Koka-shi, Shiga, JP;
Kayo Hashizume, Osaka, JP;
Yoshio Oka, Osaka, JP;
Takashi Kasuga, Osaka, JP;
Jinjoo Park, Koka, JP;
Kousuke Miura, Koka, JP;
Hiroshi Ueda, Koka, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka-shi, Shiga, JP;
Abstract
An object is to provide a substrate for a printed wiring board that has good circuit formability while maintaining adhesion strength between a conductive layer () and a base film (). The substrate includes a base film having an insulating property () and a conductive layer () formed on at least one surface of the base film (). The maximum height Sz, which is defined in ISO25178, of the surface of the base film () is 0.05 μm or more and less than 0.9 μm.