The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Jun. 01, 2016
Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;
Sumitomo Electric Printed Circuits, Inc., Koka-shi, Shiga, JP;
Kayo Hashizume, Osaka, JP;
Yoshio Oka, Osaka, JP;
Takashi Kasuga, Osaka, JP;
Jinjoo Park, Koka, JP;
Hiroshi Ueda, Koka, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka-shi, Shiga, JP;
Abstract
A substrate for a printed circuit board according to an embodiment of the present invention includes a resin film and a metal layer stacked on at least one of surfaces of the resin film. An average diffusion depth of a main metal of the metal layer in the resin film is 100 nm or less after a weather resistance test in which the substrate is held at 150° C. for seven days. The average diffusion depth is preferably 80 nm or less before the weather resistance test.