The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Sep. 24, 2018
Sumitomo Electric Industries, Ltd., Osaka, JP;
Sumitomo Electric Printed Circuits, Inc., Shiga, JP;
Motohiko Sugiura, Osaka, JP;
Issei Okada, Osaka, JP;
Takashi Kasuga, Osaka, JP;
Yoshio Oka, Osaka, JP;
Kenji Ohki, Shiga, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Shiga, JP;
Abstract
According to the present invention, a base material for a printed circuit board includes: an insulating base film; and a metal layer that is layered on at least one surface of the base film and that includes copper as a main component, wherein in a content per unit area in a region of 100 nm or less from an interface of the metal layer with the base film, Cr<0.1 mg/m, and Ni<0.1 mg/m, wherein an arithmetic mean roughness (Sa) of the surface of the base film on which the metal layer is layered is less than 0.10 μm.