Kenji Ohki

Title: Kenji Ohki: Innovator in Printed Circuit Board Technology

Introduction

Kenji Ohki is a notable inventor based in Koka, Japan, recognized for his contributions to the field of printed circuit board technology. With a total of 6 patents to his name, Ohki has made significant advancements that enhance the performance and reliability of electronic components.

Latest Patents

Ohki's latest patents focus on innovative base materials for printed circuit boards. One of his inventions describes a base material that includes an insulating base film and a sintered body layer of metal particles. This layer is designed to have an arithmetic mean roughness (Sa) of a surface that is opposite to the base film, which ranges from 0.005 μm to 0.10 μm. Another patent outlines a base material that features a metal layer, primarily composed of copper, layered on at least one surface of the base film. This invention specifies that the content of chromium and nickel in a region of 100 nm or less from the interface of the metal layer with the base film should be less than 0.1 mg/m, while maintaining an arithmetic mean roughness (Sa) of the surface of the base film at less than 0.10 μm.

Career Highlights

Throughout his career, Kenji Ohki has worked with prominent companies such as Sumitomo Electric Industries and Sumitomo Electric Printed Circuits. His experience in these organizations has allowed him to develop and refine his innovative ideas in printed circuit board technology.

Collaborations

Ohki has collaborated with notable colleagues, including Issei Okada and Motohiko Sugiura, contributing to the advancement of technology in their field.

Conclusion

Kenji Ohki's work in printed circuit board technology showcases his innovative spirit and dedication to improving electronic components. His patents reflect a commitment to enhancing the performance and reliability of these essential technologies.