The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Sep. 27, 2016
Applicants:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Sumitomo Electric Printed Circuits, Inc., Koka-shi, Shiga, JP;

Inventors:

Issei Okada, Osaka, JP;

Motohiko Sugiura, Osaka, JP;

Yoshio Oka, Osaka, JP;

Kenji Ohki, Koka, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); B22F 1/00 (2006.01); C09D 5/24 (2006.01); B22F 9/24 (2006.01); C22C 9/00 (2006.01); H01B 1/16 (2006.01); H01B 1/02 (2006.01); C09D 139/06 (2006.01); C09D 7/61 (2018.01); C09D 11/52 (2014.01); C09D 101/02 (2006.01); C09D 101/12 (2006.01); C09D 129/04 (2006.01); C09D 133/10 (2006.01);
U.S. Cl.
CPC ...
B22F 1/0018 (2013.01); B22F 9/24 (2013.01); C09D 5/24 (2013.01); C09D 7/61 (2018.01); C09D 11/52 (2013.01); C09D 101/02 (2013.01); C09D 101/12 (2013.01); C09D 139/06 (2013.01); C22C 9/00 (2013.01); H01B 1/026 (2013.01); H01B 1/16 (2013.01); H01B 1/22 (2013.01); B22F 2301/10 (2013.01); B22F 2301/205 (2013.01); C09D 129/04 (2013.01); C09D 133/10 (2013.01);
Abstract

A powder for a conductive material according to an embodiment of the present invention includes a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less. The particles contain titanium on surfaces or inside thereof, and a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less.


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