The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Sep. 24, 2018
Applicants:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Sumitomo Electric Printed Circuits, Inc., Shiga, JP;
Inventors:
Assignees:
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Shiga, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); B32B 27/28 (2006.01); B32B 27/14 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); B32B 27/14 (2013.01); B32B 27/281 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); B32B 2264/105 (2013.01); B32B 2264/1055 (2020.08); B32B 2264/301 (2020.08); B32B 2264/302 (2020.08); B32B 2307/538 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0154 (2013.01);
Abstract
A base material for a printed circuit board includes: an insulating base film; and a sintered body layer of metal particles layered on one side surface of the base film; wherein an arithmetic mean roughness (Sa) of a surface of the sintered body layer that is opposite to the base film is greater than or equal to 0.005 μm and less than or equal to 0.10 μm.