The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Aug. 01, 2016
Applicants:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Sumitomo Electric Printed Circuits, Inc., Koka-shi, Shiga, JP;

Inventors:

Kohei Okamoto, Koka, JP;

Kousuke Miura, Koka, JP;

Hiroshi Ueda, Koka, JP;

Takashi Kasuga, Osaka, JP;

Kazuhiro Miyata, Osaka, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/24 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); H05K 1/0346 (2013.01); H05K 1/092 (2013.01); H05K 3/0055 (2013.01); H05K 3/02 (2013.01); H05K 3/241 (2013.01); H05K 3/244 (2013.01); H05K 3/246 (2013.01); H05K 1/0213 (2013.01); H05K 1/0306 (2013.01); H05K 1/0313 (2013.01); H05K 1/097 (2013.01); H05K 1/11 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0347 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/0776 (2013.01); H05K 2203/0793 (2013.01); H05K 2203/095 (2013.01); H05K 2203/1126 (2013.01);
Abstract

A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film, and a lightness L* of a conductive pattern non-formed region of the base film is 60 or less. The base film may include a modified layer on one surface side thereof.


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