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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10292265 B1

PDFFull Text
Date of Patent:
May. 14, 2019

Filed:

Sep. 08, 2015

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

Applicants:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Sumitomo Electric Printed Circuits, Inc., Koka-shi, Shiga, JP;

Inventors:

Takashi Kasuga, Osaka, JP;

Yoshio Oka, Osaka, JP;

Shigeaki Uemura, Osaka, JP;

Shigeyoshi Nakayama, Osaka, JP;

Jinjoo Park, Shiga, JP;

Sumito Uehara, Shiga, JP;

Hiroshi Ueda, Shiga, JP;

Kousuke Miura, Shiga, JP;

Assignees:

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;

SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka-shi, Shiga, JP;

Attorney:

Drinker Biddle & Reath LLP

Primary Examiner:

Seth Dumbris

Int. Cl.
CPC ...
B21D 39/00 (2006.01); H05K 1/09 (2006.01); C23C 18/31 (2006.01); C23C 18/18 (2006.01); C23C 18/30 (2006.01); H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01); C23C 18/20 (2006.01); B22F 7/06 (2006.01); C09D 11/037 (2014.01); C09D 11/10 (2014.01); C09D 11/52 (2014.01); C23C 18/32 (2006.01); C23C 18/40 (2006.01); C23C 18/42 (2006.01); H05K 3/38 (2006.01); C23C 18/16 (2006.01); H05K 3/18 (2006.01); B22F 1/00 (2006.01); B22F 3/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); B22F 7/064 (2013.01); C09D 11/037 (2013.01); C09D 11/10 (2013.01); C09D 11/52 (2013.01); C23C 18/1692 (2013.01); C23C 18/1879 (2013.01); C23C 18/208 (2013.01); C23C 18/2033 (2013.01); C23C 18/2086 (2013.01); C23C 18/30 (2013.01); C23C 18/31 (2013.01); C23C 18/32 (2013.01); C23C 18/405 (2013.01); C23C 18/42 (2013.01); H05K 1/097 (2013.01); H05K 3/02 (2013.01); H05K 3/022 (2013.01); H05K 3/108 (2013.01); H05K 3/381 (2013.01); H05K 3/4661 (2013.01); B22F 1/0018 (2013.01); B22F 1/0059 (2013.01); B22F 3/16 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C23C 18/1653 (2013.01); H05K 3/18 (2013.01); H05K 2201/032 (2013.01); H05K 2203/0703 (2013.01); H05K 2203/1105 (2013.01); Y10T 428/12063 (2015.01); Y10T 428/12875 (2015.01); Y10T 428/12944 (2015.01);
Abstract

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

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