Osaka, Japan

Shigeaki Uemura

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 6.9

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2018-2022

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4 patents (USPTO):Explore Patents

Title: Shigeaki Uemura: Innovator in Printed Circuit Board Technology

Introduction

Shigeaki Uemura is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of printed circuit board technology. With a total of 4 patents to his name, Uemura's work has advanced the methods and materials used in electronic manufacturing.

Latest Patents

Uemura's latest patents include a method of making a printed circuit board and a laminated structure. This method involves several steps, including providing a double-sided plate that serves as an insulating substrate with conductive layers on both surfaces. The process includes coating the surfaces with photosensitive resin films and exposing them to light, ensuring precise control over the depth of depressions in the resin. Another significant patent focuses on a substrate for printed circuit boards, which features a base film with insulating properties and a metal layer. This substrate incorporates transition metals, such as nickel or palladium, enhancing its performance.

Career Highlights

Throughout his career, Uemura has worked with prominent companies, including Sumitomo Electric Industries and Sumitomo Electric Printed Circuits. His experience in these organizations has allowed him to refine his expertise in printed circuit board technology and contribute to innovative solutions in the industry.

Collaborations

Uemura has collaborated with notable colleagues, including Yoshio Oka and Takashi Kasuga. These partnerships have fostered a creative environment that has led to advancements in their respective fields.

Conclusion

Shigeaki Uemura's contributions to printed circuit board technology demonstrate his innovative spirit and dedication to advancing electronic manufacturing. His patents reflect a commitment to improving the efficiency and effectiveness of circuit board production.

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