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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11343918 B1

PDFFull Text
Date of Patent:
May. 24, 2022

Filed:

Dec. 17, 2018

Method of making printed circuit board and laminated structure

Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Shigeaki Uemura, Osaka, JP;

Eiko Imazaki, Osaka, JP;

Koji Nitta, Osaka, JP;

Yoshio Oka, Osaka, JP;

Hideki Matsuoka, Osaka, JP;

Ippei Tanaka, Osaka, JP;

Takayuki Yonezawa, Osaka, JP;

Assignee:

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 3/22 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01); B24C 1/00 (2006.01); B24C 1/04 (2006.01); B24C 3/00 (2006.01); B24C 3/32 (2006.01); G06F 3/044 (2006.01); G03F 7/00 (2006.01); G03F 7/004 (2006.01); G03F 7/027 (2006.01); G03F 7/031 (2006.01); G03F 7/033 (2006.01); G03F 7/039 (2006.01); G03F 7/085 (2006.01); G03F 7/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0023 (2013.01); H05K 3/108 (2013.01); H05K 3/4655 (2013.01);
Abstract

A method of making a printed circuit board includes a step of providing a double-sided plate that is an insulating substrate having conductive layers on respective surfaces thereof, a first coating step of coating a first surface of the double-sided plate with a first photosensitive resin film, a second coating step of coating a second surface of the double-sided plate with a second photosensitive resin film, a first exposure step of exposing the photosensitive resin film coating the first surface after the first and second coating steps, and a second exposure step of exposing the photosensitive resin film coating the second surface after the first exposure step, wherein a maximum depth of a depression in an outermost surface of the second photosensitive resin film used in the second exposure step is less than 1.0 μm.

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