The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Jul. 09, 2018
Sumitomo Electric Industries, Ltd., Osaka, JP;
Sumitomo Electric Printed Circuits, Inc., Shiga, JP;
Kazuhiro Miyata, Osaka, JP;
Takashi Kasuga, Osaka, JP;
Yoshio Oka, Osaka, JP;
Hiroshi Ueda, Shiga, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Shiga, JP;
Abstract
A base material for a printed circuit board includes: an insulating base film; a sintered layer that is layered on at least one side surface of the base film and that is formed of a plurality of sintered metal particles; an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film; and an electroplating layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer, wherein an arithmetic mean height Sa of the surface of the electroless plating layer opposite to the sintered layer is greater than or equal to 0.001 μm and less than or equal to 0.5 μm.