The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Nov. 16, 2023
Sumitomo Electric Industries, Ltd., Osaka, JP;
Hiroshi Ueda, Osaka, JP;
Ippei Tanaka, Osaka, JP;
Takashi Kasuga, Osaka, JP;
Masamichi Yamamoto, Osaka, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
Abstract
A printed circuit board includes: an insulating base film; and a plurality of wiring portions formed on a surface of the base film. The wiring portions include a seed layer directly or indirectly layered on the surface of the base film and a metal layer layered on the seed layer. The base film has a wiring area including the plurality of wiring portions and a non-wiring area not including the wiring portions. The plurality of wiring portions include at least one outermost boundary wiring portion and a plurality of inner wiring portions. The outermost boundary wiring portion is formed on an outermost-side of the base film in the wiring area and at a boundary between the wiring area and the non-wiring area. An average thickness of the outermost boundary wiring portion is 40 μm or more. An average width of the outermost boundary wiring portion is 30 μm or more.