The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Mar. 19, 2015
Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;
Sumitomo Electric Printed Circuits, Inc., Koka-shi, Shiga, JP;
Takashi Kasuga, Osaka, JP;
Yoshio Oka, Osaka, JP;
Shigeyoshi Nakayama, Osaka, JP;
Jinjoo Park, Shiga, JP;
Sumito Uehara, Shiga, JP;
Kousuke Miura, Shiga, JP;
Hiroshi Ueda, Shiga, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka-shi, Shiga, JP;
Abstract
A substrate for a printed circuit board includes a base film having an insulating property; a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film, wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles, the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 μg/cmor more and 10 μg/cmor less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.