The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Mar. 26, 2015
Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;
Sumitomo Electric Printed Circuits, Inc., Koka-shi, Shiga, JP;
Takashi Kasuga, Osaka, JP;
Yoshio Oka, Osaka, JP;
Jinjoo Park, Shiga, JP;
Sumito Uehara, Shiga, JP;
Kousuke Miura, Shiga, JP;
Hiroshi Ueda, Shiga, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka-shi, Shiga, JP;
Abstract
A substrate for a printed circuit board according to the present invention includes a base film having an insulating property and including at least one opening; a first conductive layer that is formed on both surfaces of the base film by applying and heat-treating a conductive ink containing metal particles, and that fills the at least one opening; and a second conductive layer formed, by plating, on at least one of surfaces of the first conductive layer. The metal particles preferably have a mean particle size of 1 nm or more and 500 nm or less.