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For the Inventor, By the Inventor

Suwon, South Korea

Sung Yi

This inventor holds 18 USPTO granted patents and 6 published patent applications. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2009-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sung Yi. Retrieved from https://idiyas.com/inventor/sung-yi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 16.7

Average Co-Inventor Count = 3.6

ph-index = 5

Forward Citations = 103(Granted Patents)


Location History:

  • Gyunggi-do, KR (2011 - 2013)
  • Suwon-si, KR (2009 - 2015)

Company Filing History:

goldMedal18 out of 7,633 
 
Samsung Electro-Mechanics Co., Ltd.
 patents

Years Active: 2009-2015

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18 patents (USPTO):Explore Patents
1. 8943685 - Method of manufacturing a capacitor-embedded printed circuit board (2015-02-03),
2. 8893380 - Method of manufacturing a chip embedded printed circuit board (2014-11-25),
3. 8779580 - Electronic component package and manufacturing method thereof (2014-07-15),
4. 8552305 - Electronic component-embedded printed circuit board (2013-10-08),
5. 8351215 - Method of manufacturing a chip embedded printed circuit board (2013-01-08),
6. 8302270 - Method of manufacturing capacitor-embedded PCB (2012-11-06),
7. 8283768 - Wafer Level package for heat dissipation and method of manufacturing the same (2012-10-09),
8. 8283251 - Method of manufacturing wafer level package (2012-10-09),
9. 8110914 - Wafer level package with removable chip protecting layer (2012-02-07),
10. 8064215 - Semiconductor chip package and printed circuit board (2011-11-22),
11. 8026590 - Die package and method of manufacturing the same (2011-09-27),
12. 7992296 - PCB and manufacturing method thereof (2011-08-09),
13. 7982982 - Wafer level packaging image sensor module having lens actuator and method of manufacturing the same (2011-07-19),
14. 7886414 - Method of manufacturing capacitor-embedded PCB (2011-02-15),
15. 7730612 - Method of manufacturing component-embedded printed circuit board (2010-06-08),

Title: Innovations of Sung Yi in Printed Circuit Board Technology

Introduction

Sung Yi is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of printed circuit board technology, holding a total of 18 patents. His work focuses on innovative methods for manufacturing advanced circuit boards that enhance electronic device performance.

Latest Patents

Sung Yi's latest patents include a "Method of manufacturing a capacitor-embedded printed circuit board" and a "Method of manufacturing a chip embedded printed circuit board." The first patent describes a process that involves forming conductive layers and electrodes on an insulation layer to create a capacitor-embedded design. The second patent outlines a manufacturing method for a chip embedded printed circuit board, which includes an insulating layer with embedded chips and patterns that connect to the chips' pads.

Career Highlights

Sung Yi is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in the field of electronics. His expertise in circuit board technology has positioned him as a key player in the industry, contributing to the advancement of electronic components.

Collaborations

Throughout his career, Sung Yi has collaborated with notable colleagues, including Joon Seok Kang and Young Do Kweon. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Sung Yi's contributions to printed circuit board technology exemplify his dedication to innovation and excellence. His patents reflect a commitment to enhancing electronic device functionality, making him a valuable asset in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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