The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2013

Filed:

Jan. 28, 2009
Applicants:

Hong Won Kim, Suwon-si, KR;

Sung Yi, Suwon-si, KR;

Tae Sung Jeong, Hwaseong-si, KR;

Joon Seok Kang, Suwon-si, KR;

Inventors:

Hong Won Kim, Suwon-si, KR;

Sung Yi, Suwon-si, KR;

Tae Sung Jeong, Hwaseong-si, KR;

Joon Seok Kang, Suwon-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The present invention provides the chip embedded printed circuit board including an insulating layer embedding a chip provided with posts at an upper part, vias formed through the insulating layer, upper patterns formed at the upper part of the insulating layer to be connected to the posts and the vias and lower patterns formed at a lower part of the insulating layer to be connected to the vias, and the manufacturing method thereof.


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