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For the Inventor, By the Inventor

Suwon, South Korea

Tae Sung Jeong

This inventor holds 27 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Packaging. Top assignees: Samsung Electro-Mechanics Co., Ltd., Samsung Electronics Co., Ltd., Other. Active years: 1984-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tae Sung Jeong. Retrieved from https://idiyas.com/inventor/tae-sung-jeong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 85.2

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 93(Granted Patents)


Location History:

  • Seoul, KR (1984)
  • Hwaseong-si, KR (2013 - 2014)
  • Suwon, KR (2014)
  • Gyeonggi-do, KR (2014)
  • Gyunggi-do, KR (2014 - 2015)
  • Suwon-si, KR (2017 - 2023)

Company Filing History:

goldMedal15 out of 7,633 
 
Samsung Electro-Mechanics Co., Ltd.
 patents
silverMedal11 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents
bronzeMedal1 out of 834,513 
Other
 patents

Years Active: 1984-2025

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Areas of Expertise:
Fan-Out Semiconductor Package
Embedded Electronic Component
Carrier Substrate
Acoustic Wave Device
Sensor Package
Chip Embedded Printed Circuit Board
Printed Circuit Board
Embedded Ball Grid Array
27 patents (USPTO):Explore Patents
1. 12394703 - Fan-out semiconductor package (2025-08-19),
2. 11810848 - Fan-out semiconductor package (2023-11-07),
3. 11444043 - Substrate having embedded electronic component (2022-09-13),
4. 11189552 - Semiconductor package (2021-11-30),
5. 11094623 - Fan-out semiconductor package (2021-08-17),
6. 10796997 - Semiconductor package (2020-10-06),
7. 10790224 - Carrier substrate and method of manufacturing semiconductor package using the same (2020-09-29),
8. 10665535 - Semiconductor package (2020-05-26),
9. 10580812 - Fan-out sensor package and camera module including the same (2020-03-03),
10. 10580728 - Fan-out semiconductor package (2020-03-03),
11. 10447411 - Acoustic wave device and method of manufacturing the same (2019-10-15),
12. 10438884 - Carrier substrate and method of manufacturing semiconductor package using the same (2019-10-08),
13. 10431615 - Fan-out sensor package and camera module including the same (2019-10-01),
14. 10340234 - Substrate having embedded electronic component (2019-07-02),
15. 10340153 - Fan-out semiconductor package and method of manufacturing same (2019-07-02),

Title: Spotlight on Inventor Tae Sung Jeong

Introduction:

Meet Tae Sung Jeong, a prolific inventor based in Suwon-si, South Korea. With an impressive track record of 25 patents, Jeong is known for his groundbreaking innovations in the field of semiconductor packaging and embedded electronic components.

Latest Patents:

Jeong's recent patents showcase his expertise in fan-out semiconductor packaging. One of his inventions includes a fan-out semiconductor package that enhances reliability by reducing stress through innovative layouts of vias and pads. Another notable patent is for a substrate with an embedded electronic component, featuring an antenna layer for advanced connectivity.

Career Highlights:

During his career, Jeong has made significant contributions to industry giants such as Samsung Electro-mechanics Co., Ltd. and Samsung Electronics Co., Ltd. His innovative solutions have played a crucial role in advancing semiconductor technology and electronic components.

Collaborations:

Jeong has collaborated with esteemed professionals in the field, including Jae Ean Lee and Young Gwan Ko. Together, they have worked on cutting-edge projects that have pushed the boundaries of innovation in the industry.

Conclusion:

In conclusion, Tae Sung Jeong stands out as a pioneering inventor in the realm of semiconductor packaging and electronic components. His dedication to improving reliability and performance through patented technologies has made a lasting impact on the industry. Jeong's continued innovation and collaboration promise a future filled with groundbreaking discoveries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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