The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Apr. 30, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jae Ean Lee, Suwon-si, KR;
Tae Sung Jeong, Su-won-si, KR;
Young Gwan Ko, Suwon-si, KR;
Ik Jun Choi, Suwon-si, KR;
Jung Soo Byun, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/498 (2006.01); H01L 23/15 (2006.01); H01L 21/56 (2006.01); H01L 23/532 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/15 (2013.01); H01L 23/49822 (2013.01); H01L 23/53228 (2013.01); H01L 23/49816 (2013.01); H01L 2221/68318 (2013.01);
Abstract
A carrier substrate comprises a core layer, a first metal layer disposed on the core layer, a release layer disposed on the first metal layer, and a second metal layer disposed on the release layer. At least one layer among the first metal layer, the release layer, and the second metal layer is disposed in a plurality of unit pattern portions having an area smaller than an area of the core layer. In addition, a method of manufacturing a semiconductor package using the carrier substrate is provided.