Suwon-si, South Korea

Jae Ean Lee

USPTO Granted Patents = 10 

Average Co-Inventor Count = 5.0

ph-index = 3

Forward Citations = 28(Granted Patents)


Company Filing History:


Years Active: 2019-2023

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10 patents (USPTO):Explore Patents

Title: Innovations by Jae Ean Lee: Pioneering Semiconductor Technologies

Introduction

Jae Ean Lee is a prominent inventor based in Suwon-si, South Korea, known for his significant contributions to the field of semiconductor technology. With a portfolio of 10 patents, he has established himself as a leading figure in innovation, particularly in the domain of semiconductor packaging.

Latest Patents

Among Jae Ean Lee's latest patents are innovative methods for manufacturing semiconductor packages. One notable patent describes a fan-out semiconductor package which involves a sophisticated process of disposing a semiconductor chip with contact pads on a supporting substrate. This package includes a connection structure that encapsulates the chip and integrates a wiring pattern to create conductive vias that enhance connectivity and performance. Another key patent outlines a semiconductor package consisting of a semiconductor chip and a connection member, focusing on the design of a passivation layer and an under-bump metallization (UBM) layer that improves the functionality and reliability of semiconductor devices.

Career Highlights

Lee has made substantial contributions during his tenure at leading companies in the electronics sector, particularly at Samsung Electronics Co., Ltd. and Samsung Electro-mechanics Co., Ltd. His work has greatly influenced the advancement of semiconductor technology, leading to more efficient and reliable electronic components.

Collaborations

Throughout his career, Jae Ean Lee has collaborated with notable coworkers including Young Gwan Ko and Jung Soo Byun. These collaborations have facilitated the exchange of innovative ideas and concepts, driving forward the development of cutting-edge semiconductor solutions.

Conclusion

Jae Ean Lee's dedication to innovation in semiconductor technology is evident through his numerous patents and successful collaborations. As he continues to push the boundaries of what is possible in the field, his contributions will undoubtedly leave a lasting impact on the industry.

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