The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Dec. 20, 2016
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Yong Ho Baek, Suwon-si, KR;
Sang Kun Kim, Suwon-si, KR;
Ye Jeong Kim, Suwon-si, KR;
Jae Ean Lee, Suwon-si, KR;
Jae Hoon Choi, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.