Sang Kun Kim

Title: The Innovations of Sang Kun Kim

Introduction

Sang Kun Kim is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of electronic component packaging, holding a total of 3 patents. His work has been instrumental in advancing technology in this area.

Latest Patents

One of his latest patents is an electronic component package and manufacturing method. This innovative package includes first and second wiring parts that consist of insulating layers, conductive patterns formed within these layers, and conductive vias that penetrate through the insulating layers. These components are designed to connect to the conductive patterns effectively. Additionally, a frame is positioned between the first and second wiring parts, featuring conductive connection parts that electrically link one or more through-holes with the wiring parts. An electronic component is strategically placed to be surrounded by the through-hole, ensuring a connection to the first wiring part. Notably, the conductive patterns adjacent to the electronic component are embedded within the insulating layer of the first wiring part.

Career Highlights

Sang Kun Kim has had a distinguished career, working with prominent companies such as Samsung Electro-Mechanics Co., Ltd. and Samsung Electronics Co., Ltd. His experience in these leading organizations has allowed him to refine his skills and contribute to groundbreaking innovations in electronic components.

Collaborations

Throughout his career, Sang Kun Kim has collaborated with talented individuals, including Yong Ho Baek and Ye Jeong Kim. These partnerships have fostered a creative environment that has led to the development of innovative solutions in the field.

Conclusion

Sang Kun Kim's contributions to electronic component packaging demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of technology and its applications, making him a significant figure in the industry.