The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Jan. 29, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ik Jun Choi, Suwon-si, KR;
Jae Ean Lee, Suwon-si, KR;
Kwang Ok Jeong, Suwon-si, KR;
Young Gwan Ko, Suwon-si, KR;
Jung Soo Byun, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A method for manufacturing a semiconductor package includes disposing a semiconductor chip having contact pads, and a connection structure around the semiconductor chip on a supporting substrate, with the contact pads facing the supporting substrate, forming an encapsulant encapsulating the semiconductor chip and the connection structure on the supporting substrate, embedding a wiring pattern having a connection portion in the encapsulant, the connection portion having a connection hole, forming a through hole penetrating the encapsulant in the connection hole, the through hole exposing a portion of an upper surface of the connection structure, and forming a conductive via in the through hole, the conductive via connecting the wiring pattern to the connection structure.