The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Sep. 22, 2011
Applicants:
Seung Seoup Lee, Yongin-si, KR;
Sung Yi, Suwon-si, KR;
Inventors:
Seung Seoup Lee, Yongin-si, KR;
Sung Yi, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing a wafer level package including: forming a redistribution line connected to a top surface of a die pad on a wafer with the die pad; additionally preparing a carrier film including a metal post with a concave central portion on one surface; bonding the metal post to a top surface of the redistribution line; molding a space between the metal posts with a molding resin; and removing the carrier film.
Lee, Seung. (2012). Method of manufacturing wafer level package (U.S. Patent No. 8283251). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8283251
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile