IDiyas

For the Inventor, By the Inventor

Gyunggi-do, South Korea

Seung Seoup Lee

USPTO Granted Patents = 18 

 

Average Co-Inventor Count = 1.4

ph-index = 3

Forward Citations = 122(Granted Patents)


Location History:

  • Gyeonggi-do, KR (2013)
  • Yongin-si, KR (2012 - 2014)
  • Gyunggi-do, KR (2011 - 2015)
  • Suwon-Si, KR (2015)
  • Yongin, KR (2014 - 2016)
  • Suwon, KR (2016)

Company Filing History:

goldMedal18 out of 7,574 
 
Samsung Electro-mechanics Co., Ltd.
 patents

Years Active: 2011-2016

Loading Chart...
Loading Chart...
18 patents (USPTO):Explore Patents
1. 9502464 - Method of manufacturing optical image stabilizer (2016-11-22),
2. 9331070 - Variable capacitor and integrated circuit including the same (2016-05-03),
3. 9153641 - Wafer level package having cylindrical capacitor and method of fabricating the same (2015-10-06),
4. 9128350 - Micro-iris unit and camera module including the same (2015-09-08),
5. 9060734 - Fixed focus transducer array and ultrasonic wave transceiving apparatus using the same (2015-06-23),
6. 8921146 - Method for manufacturing optical image stabilizer employing scratch drive actuator (2014-12-30),
7. 8736139 - Optical image stabilizer and method of manufacturing the same (2014-05-27),
8. 8666126 - Fingerprint detection sensor and method of detecting fingerprint (2014-03-04),
9. 8656582 - Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer (2014-02-25),
10. 8624618 - Apparatus and method for inspecting circuit of substrate (2014-01-07),
11. 8614391 - Device for converting energy and method for manufacturing the device, and electronic apparatus with the device (2013-12-24),
12. 8593532 - Optical image stabilizer employing a scratch drive actuator (2013-11-26),
13. 8471581 - Apparatus and method for inspecting defects in circuit pattern of substrate (2013-06-25),
14. 8410465 - Apparatus and method for inspecting defects of a circuit pattern formed on a substrate using a laser and a non-contact capacitor sensor (2013-04-02),
15. 8378452 - Wafer level package having cylindrical capacitor and method of fabricating the same (2013-02-19),
This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…