Samsung Electro-mechanics Co., Ltd.

Seung Seoup Lee

Soon Gyu Yim

Sung Yi

In Kyung Park

Jae Hyouck Choi

Jun Kyung Na

Jong Woo Han

Jae Cheon Doh

Tak Gyum Kim

Il Kwon Chung

Jin Won Park

Dong Chul Shin

A method of manufacturing an optical image stabilizer including providing a silicon-on-insulator (SOI) substrate that includes first and second silicon each provided on an upper surface and a lower surface of the substrate, having an insulator layer therebetween, forming a table, a cantilever arm connected to the table, an anchor connected to the cantilever arm, and an electrode opposite to the cantilever arm by etching the first silicon, allowing the table and the cantilever arm to levitate from the second silicon by removing an insulator layer disposed under the table and the cantilever arm, and mounting an image sensor on the table.

Method of manufacturing optical image stabilizer

There are provided a variable capacitor and an integrated circuit (IC) including the variable capacitor. The variable capacitor includes: a plurality of capacitance forming portions that are connected to each other in parallel between a first port and a second port and provide previously set capacitance according to a control signal, wherein each of the plurality of capacitance forming portions includes: a first capacitance forming portion including a first switch portion including a plurality of switches, and a first capacitor portion including first and second capacitors; and at least one capacitance forming group including a unit switch portion including a plurality of switches, and at least one unit capacitance forming portion including at least one unit capacitor portion including a unit capacitor.

Variable capacitor and integrated circuit including the same

Disclosed is a wafer level package having a cylindrical capacitor, which is capable of increasing electrostatic capacity thanks to the use of a cylindrical capacitor structure and which includes a wafer chip having a bonding pad formed thereon and an insulating layer formed thereon and exposing the bonding pad, a redistribution layer connected to the bonding pad and extending to one side of the insulating layer, a cylindrical outer electrode connected to the redistribution layer and having a center opening therein, a cylindrical inner electrode formed in the center opening of the outer electrode so as to be separated from the outer electrode, a dielectric layer formed between the outer electrode and the inner electrode, and a resin sealing portion formed on the insulating layer to cover the redistribution layer, the inner electrode, the outer electrode and the dielectric layer and having a first recess for exposing an upper surface of the inner electrode. A method of fabricating the wafer level package having a cylindrical capacitor is also provided.

Wafer level package having cylindrical capacitor and method of fabricating the same

A micro-iris unit may include: a support member disposed on a transparent substrate to form a fluid accommodating space in a central portion of the transparent substrate; a first fluid provided in the fluid accommodating space; and a second fluid provided in the fluid accommodating space and being movable by an electrical field or electromagnetic force. A side surface of the support member may include flexures or concave-convex portions to allow an area of contact with the first fluid or the second fluid to be significantly increased.

Micro-iris unit and camera module including the same

There are provided a fixed focus transducer array and an ultrasonic wave transceiving apparatus using the same. The fixed focus transducer array includes: a plurality of transducers, transducing electrical signals into ultrasonic signals to thereby focus the ultrasonic signals on a single focal point and transducing reflected ultrasonic signals from the single focal point into electrical signals to thereby output the electrical signals, wherein the plurality of transducers are disposed to be symmetrical to each other based on one transducer and simultaneously focus the ultrasonic signals on the single focal point at speeds according to the respective natural frequencies thereof. Therefore, a circuit area is reduced, whereby miniaturization may be implemented and a processing speed may be increased.

Fixed focus transducer array and ultrasonic wave transceiving apparatus using the same

A method for an optical image stabilizer including: providing an SOI wafer substrate which has a plurality of cells, the SOI wafer substrate including an insulating layer, and first and second silicon layers disposed on both sides of the insulating layer; forming scratch drive arrays and supporting members on each of the cells by etching the first silicon layer; forming the table through cells' separation by etching the second silicon layer and the insulating layer; removing the insulating layer interposed between the scratch drive arrays and the table; mounting the image sensor on the table; forming the substrate which has an electrode layer corresponding to the scratch drive arrays; and assembling the table with the image sensor and the scratch drive arrays on the substrate having the electrode layer in such a manner that the scratch drive arrays face the electrode layer each other.

Method for manufacturing optical image stabilizer employing scratch drive actuator

Disclosed herein is an optical image stabilizer, including: a substrate; a table disposed over the substrate, while levitating, to be movable on the substrate and having an image sensor mounted on the upper end of the substrate; cantilever arms disposed over the substrate, while levitating, and connected to the table to move the table; anchors fixing one ends of the cantilever arms onto the substrate; and electrodes applying voltage for moving the cantilever arm.

Optical image stabilizer and method of manufacturing the same

There is provided a fingerprint detection sensor and a method of detecting a fingerprint. The fingerprint detection sensor according to embodiments of the present invention includes a plurality of piezoelectric sensors arranged on a two-dimensional plane; and a fingerprint detection unit detecting a fingerprint by using ultrasonic signals discharged from the plurality of respective piezoelectric sensors, wherein the fingerprint detection unit determines whether the fingerprint is a forged fingerprint by detecting bloodstreams within a first region on the two-dimensional plane in which the ultrasonic signals discharged from the plurality of respective piezoelectric sensors overlap one another.

Fingerprint detection sensor and method of detecting fingerprint

Disclosed herein are a method of attaching a die using a self-assembling monolayer and a package substrate including a die attached thereto using a self-assembling monolayer. A first self-assembling monolayer formed on a die and a second self-assembling monolayer formed on a substrate are provided with the same hydrophilic or hydrophobic functional group, so that the die is attached to the substrate using an attractive force acting between the first and second self-assembling monolayers. An accuracy of alignment between the die and the substrate can be improved by the simple solution.

Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer

An apparatus and method for inspecting a circuit of a substrate is described. The apparatus includes a pin probe coming into contact with a first end of an electrode formed on a first side of a substrate, a voltage source for applying a voltage to the pin probe, a film disposed at a second end of the electrode formed on a second side of the substrate, a dielectric fluid sealed in the film, and an electronic ink dispersed in the dielectric fluid, and charged with electricity to flow when the electrode is electrified. The present invention is advantageous in that whether an electrode has been electrified is measured using charged electronic ink, so that the use of a pin probe is limited to one side of a substrate, thus reducing cost required for the entire inspection.

Apparatus and method for inspecting circuit of substrate

The present invention provides an energy converting device, which includes: a base substrate; and a plurality of thermoelectric element structures which are sequentially stacked on the base substrate and electrically interconnected in parallel to one another.

Device for converting energy and method for manufacturing the device, and electronic apparatus with the device

The present invention provides an optical image stabilizer including: a substrate; a table which faces the substrate and has an image sensor mounted on its upper surface to be horizontally actuated on the substrate; supporting members for supporting the table on the substrate; and a scratch drive actuator for actuating the table, and a method for manufacturing thereof.

Optical image stabilizer employing a scratch drive actuator

Disclosed herein is an apparatus and method for inspecting defects in the circuit pattern of a substrate. The apparatus for inspecting defects in a circuit pattern of a substrate includes a pin probe configured to input a voltage while coming into contact with an inspection target circuit pattern of a substrate. A capacitor sensor is provided with a membrane electrode which is opposite a connection circuit pattern to be electrically connected to the inspection target circuit pattern in a non-contact manner, and is configured to detect both capacitance and capacitance variation, generated due to displacement of the membrane electrode attributable to electrostatic attractive force acting from the connection circuit pattern on the membrane electrode. A capacitance measurement unit is connected to the capacitor sensor and is configured to measure capacitance attributable to the displacement of the membrane electrode, which is input from the capacitor sensor.

Apparatus and method for inspecting defects in circuit pattern of substrate

An apparatus for inspecting defects in a circuit pattern is described. The apparatus includes at least one laser unit for radiating a laser beam onto a first end of a circuit pattern formed on a substrate. The apparatus also includes a capacitor sensor disposed opposite a second end of the circuit pattern, which is connected to the first end of the circuit pattern through a via hole, in a non-contact manner. The apparatus also includes a voltage source connected to the capacitor sensor and configured to apply a voltage. The apparatus also includes a measurement unit connected to the capacitor sensor and configured to detect variation in impedance generated in the capacitor sensor.

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Gyunggi-do, South Korea

Seung Seoup Lee