The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2011
Filed:
Sep. 05, 2008
Applicants:
Yul-kyo Chung, Yongin-si, KR;
Sung Yi, Suwon-si, KR;
Soon-gyu Yim, Seongnam-si, KR;
Seog-moon Choi, Seoul, KR;
Jin-gu Kim, Suwon-si, KR;
Young-do Kweon, Seoul, KR;
Inventors:
Yul-Kyo Chung, Yongin-si, KR;
Sung Yi, Suwon-si, KR;
Soon-Gyu Yim, Seongnam-si, KR;
Seog-Moon Choi, Seoul, KR;
Jin-Gu Kim, Suwon-si, KR;
Young-Do Kweon, Seoul, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor chip package and a printed circuit board having an embedded semiconductor chip package are disclosed. The semiconductor chip package may include a semiconductor chip that has at least one chip pad formed on one side, and a capacitor formed on the other side of the semiconductor chip.