The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Oct. 17, 2009
Applicants:
Joon Seok Kang, Gyunggi-do, KR;
Young Ho Kim, Seoul, KR;
Young DO Kweon, Seoul, KR;
Jin Gu Kim, Gyunggi-do, KR;
Sung Yi, Gyunggi-do, KR;
Inventors:
Joon Seok Kang, Gyunggi-do, KR;
Young Ho Kim, Seoul, KR;
Young Do Kweon, Seoul, KR;
Jin Gu Kim, Gyunggi-do, KR;
Sung Yi, Gyunggi-do, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/488 (2006.01); H01L 21/58 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed herein are a die package and a method of manufacturing the die package. A solder layer is formed on a lower surface of a die. The die is self-aligned and attached to a support plate using surface tension between the solder layer and a metal layer of the support plate, thus reducing attachment lead time of the die.