The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Jan. 27, 2009
Hong Won Kim, Suwon-si, KR;
Sung Yi, Suwon-si, KR;
Tae Sung Jeong, Hwaseong-si, KR;
Joon Seok Kang, Suwon-si, JP;
Hong Won Kim, Suwon-si, KR;
Sung Yi, Suwon-si, KR;
Tae Sung Jeong, Hwaseong-si, KR;
Joon Seok Kang, Suwon-si, JP;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof and provides a chip embedded printed circuit board including: an insulating layer having vias formed therethrough; a first chip and a second chip embedded in the insulating layer and having pads, which are respectively exposed to upper and lower surfaces of the insulating layer, on one surfaces thereof; an upper pattern formed on the upper surface of the insulating layer to be connected to the pads of the first chip and the vias; and a lower pattern formed on the lower surface of the insulating layer to be connected to the pads of the second chip and the vias. Also, the present invention provides a manufacturing method of a chip embedded printed circuit board.