The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Jan. 23, 2008
Joon-seok Kang, Suwon-si, KR;
Sung Yi, Suwon-si, KR;
Jae-cheon Doh, Suwon-si, KR;
Do-jae Yoo, Seoul, KR;
Sun-kyong Kim, Seoul, KR;
Jong-hwan Baek, Seoul, KR;
Joon-Seok Kang, Suwon-si, KR;
Sung Yi, Suwon-si, KR;
Jae-Cheon Doh, Suwon-si, KR;
Do-Jae Yoo, Seoul, KR;
Sun-Kyong Kim, Seoul, KR;
Jong-Hwan Baek, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
An electronic component package and a manufacturing method thereof are disclosed. The electronic component package manufacturing method, which includes mounting an electronic component in one surface of a first insulation layer; bonding a heat sink to the one surface of the first insulation layer, corresponding to the electronic component, to cover the electronic component, the heat sink being formed with a cavity; charging the cavity with an adhesive; and forming a circuit pattern in the other surface of the first insulation layer, can prevent a void from being generated in the adhesive, make the handling stable and make the size small by allowing the heat sink formed with the cavity to cover the electronic component before the pattern build-up and supplying the adhesive through one side of the cavity while providing negative pressure through the other side.