This inventor holds 2 USPTO granted patents. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2014-2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Suwon-si, KR (2014)
- Gyeonggi-do, KR (2015)
Company Filing History:
Years Active: 2014-2015
Title: Jae-Cheon Doh: Innovator in Semiconductor Technology
Introduction
Jae-Cheon Doh is a prominent inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to electronic component packaging.
Latest Patents
One of his latest patents is for a semiconductor package and method of manufacturing the semiconductor package. This invention includes a substrate with a ground circuit, a semiconductor chip mounted on the substrate, and a conductive first shield connected to the ground circuit. Additionally, a conductive second shield covers both the substrate and the semiconductor chip, enhancing the grounding capabilities between semiconductor chips through a double shielding structure.
Another notable patent is for an electronic component package and its manufacturing method. This method involves mounting an electronic component on a first insulation layer, bonding a heat sink to cover the component, and charging a cavity within the heat sink with adhesive. This innovative approach prevents voids in the adhesive, stabilizes handling, and reduces size by allowing the heat sink to cover the component before the circuit pattern is built.
Career Highlights
Jae-Cheon Doh is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop cutting-edge technologies in the semiconductor industry. His work has been instrumental in advancing the efficiency and effectiveness of electronic component packaging.
Collaborations
Throughout his career, Jae-Cheon has collaborated with talented individuals such as Do-Jae Yoo and Sun-Kyong Kim. These collaborations have contributed to the successful development of innovative technologies in their field.
Conclusion
Jae-Cheon Doh is a key figure in semiconductor innovation, with patents that reflect his expertise and commitment to advancing technology. His contributions continue to shape the future of electronic components and packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile