Seoul, South Korea

Do-Jae Yoo

USPTO Granted Patents = 7 

Average Co-Inventor Count = 4.1

ph-index = 4

Forward Citations = 62(Granted Patents)


Location History:

  • Seoul, KR (2010 - 2014)
  • Suwon-si, KR (2015)
  • Gyeonggi-do, KR (2015)

Company Filing History:


Years Active: 2010-2015

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7 patents (USPTO):Explore Patents

Title: Do-Jae Yoo: Innovator in Semiconductor Packaging

Introduction

Do-Jae Yoo is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 7 patents. His work focuses on enhancing the performance and reliability of semiconductor devices through innovative packaging solutions.

Latest Patents

One of his latest patents is for a semiconductor package with a conductive shielding member. This invention includes a substrate with a ground circuit and a semiconductor chip mounted on one surface. A conductive ground layer is formed on the other surface of the substrate, connected to the ground circuit. The package is sealed with a molding that covers the ground layer and the substrate. A conductive shield is then placed over the molding, providing effective grounding for shielding, even in a fully molded structure. This design improves the shielding properties through a double shielding structure.

Another notable patent involves a semiconductor package and a method of manufacturing it. This package features a substrate with a ground circuit, a semiconductor chip mounted on it, and a conductive first shield on the upper surface of the chip, connected to the ground circuit. A second conductive shield covers both the substrate and the chip, enhancing grounding between semiconductor chips and improving the overall shielding property.

Career Highlights

Do-Jae Yoo is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packages, making them more efficient and reliable.

Collaborations

He has collaborated with notable coworkers, including Young-Do Kweon and Seog-Moon Choi, contributing to various projects that push the boundaries of semiconductor packaging technology.

Conclusion

Do-Jae Yoo's contributions to semiconductor packaging through his innovative patents have significantly impacted the industry. His work at Samsung Electro-Mechanics Co., Ltd. showcases his commitment to advancing technology in this critical field.

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