The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2011
Filed:
Dec. 01, 2009
Do-jae Yoo, Seoul, KR;
Young-do Kweon, Seoul, KR;
Seog-moon Choi, Seoul, KR;
Bum-sik Jang, Seongnam-si, KR;
Tae-sung Jeong, Hwaseong-si, KR;
Do-Jae Yoo, Seoul, KR;
Young-Do Kweon, Seoul, KR;
Seog-Moon Choi, Seoul, KR;
Bum-Sik Jang, Seongnam-si, KR;
Tae-Sung Jeong, Hwaseong-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method of manufacturing a semiconductor package which includes mounting a first chip on a first substrate by a flip chip method, the first substrate having a pre-designed pattern formed thereon; forming a cavity by etching a center portion of a metal oxide layer; mounting a second chip inside the cavity; forming at least one via such that the via penetrates an edge of the metal oxide layer; placing the metal oxide layer on the first substrate such that the second chip and the first chip face each other; and placing a second substrate on the metal oxide layer, the second substrate having a third chip mounted thereon.