Bum-Sik Jang

Title: Bum-Sik Jang: Innovator in Semiconductor Packaging

Introduction

Bum-Sik Jang is a prominent inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His innovative methods have advanced the technology used in semiconductor manufacturing.

Latest Patents

Bum-Sik Jang's latest patents include a method for manufacturing a semiconductor package. This method involves mounting a first chip on a first substrate using a flip chip method, with a pre-designed pattern formed on the substrate. The process also includes forming at least one bump through soldering at predetermined positions, molding to cover the first substrate and chip, and placing an interposer and a second substrate with a second chip mounted on it. Another patent details a similar method, which includes etching a cavity in a metal oxide layer, mounting a second chip inside the cavity, and ensuring that the first and second chips face each other.

Career Highlights

Bum-Sik Jang is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor packages.

Collaborations

He collaborates with notable coworkers, including Do-Jae Yoo and Young-Do Kweon, who contribute to the advancements in their shared field.

Conclusion

Bum-Sik Jang's contributions to semiconductor packaging through his innovative patents and collaborations highlight his importance in the industry. His work continues to influence the future of semiconductor technology.