The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2011
Filed:
Dec. 01, 2009
Do-jae Yoo, Seoul, KR;
Young-do Kweon, Seoul, KR;
Seog-moon Choi, Seoul, KR;
Bum-sik Jang, Seongnam-si, KR;
Tae-sung Jeong, Hwaseong-si, KR;
Do-Jae Yoo, Seoul, KR;
Young-Do Kweon, Seoul, KR;
Seog-Moon Choi, Seoul, KR;
Bum-Sik Jang, Seongnam-si, KR;
Tae-Sung Jeong, Hwaseong-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A semiconductor package which includes a first substrate having a pre-designed pattern formed thereon; a first chip mounted by a flip chip method on one side of the first substrate; a support formed to a predetermined thickness on an edge of the first substrate; an interposer having an edge thereof placed on the support, such that the interposer covers the first substrate and forms a cavity between the interposer and the first substrate, and having a pre-designed pattern formed respectively on both sides thereof; a via penetrating the support and the interposer; a second chip mounted on one side of the interposer facing the first substrate; a second substrate placed on the other side of the interposer with at least one conductive ball positioned in-between; and a third chip mounted on the second substrate.